Aluminum Oxide Copper Plating Machine, PVD Copper Plating on Ceramic Sheets,
Keywords: Direct Plated Copper, DPC, Ceramic Copper Plating, PVD Hard Coatings, PECVD process, DLC film, Diamond Like Carbon Film, Sputtering Optical film, Gencoa Magnetron Sputtering Cathode, Ion Source, PA PVD
RTAC950-SP Design Features:
- Flexibility: arc and sputter sources, linear ion source devices mounting flanges are standardized for flexible exchange
- Versatility: available for deposit variety of base metals and alloys, optical coatings and hard coatings, soft coatings. Compound films and solid lubricating films on the metallic and non-metallic materials substrates
- Straight forward design: 2-door structure, front and back opening for easy maintenance
Technical Specifications
1. Ultimate Vacuum Pressure: better than 8.0*10-4 Pa;
- Base Vacuum pressure: 3.0*10-2 Pa
3. Pumping down Time: from atm to 1.0×10-3 Pa≤15 minutes ( room temperature, dry, clean and empty chamber)
4. Deposition source: Gencoa magnetron sputtering cathodes, steered arc cathodes, Ion source
5. Operating Model: Full Automatically /Semi-Auto/ Manually
6. Heating: from room temperature up to max. 500℃,
9. Ion source for PECVD and PA PVD process.
The vacuum coating machine contains key completed system listed below:
1. Vacuum Chamber
1.1 Size: Inner Depth 950mm
Inner Height:1350mm
1.2 Material: Vacuum Chamber SUS304
Door and flanges SUS304
Chamber strengthen structure: SS41 mild steel, with painted finishing surface treatment.
Chamber chassis SS41 mild steel with painted finishing surface treatment.
1.3 Chamber Shield : SUS304
1.4 View Window: on chamber doors -2
1.5 Vacuum Chamber Venting Valve (including silencer)
1.6 Door: 2 sets, front and back, SUS304 material
2. Roughing Vacuum Pumping System:
Oil rotary vane vacuum pump + Holding Pump
3. High Vacuum Pumping System:
Turbo Molecular Pump - 2 sets
4. Electrical Control and Operation System- PLC+ Touch ScreenOperation System:
Suppliers:
PLC: Mitsubishi, Model:FX-IN60MR-001 SERIES
Electronic Components: SCHNEIDER,OMRON.
Safety Protecting System: Numerous safety interlocks to protect operators and equipment ( water, current gas, temperature etc.)
Coating Processes System: Process Automation & Control. Automatically saved in memory for 3 months. Featured coating recipes data: target operation current/voltage, Mass Flow, Vacuum pressure, temperature, coating times are saved for an analysis to enhance the coatings quality.
4.1 Main circuit: None-fuse breaker switch, electromagnetic switch, C/T in series type
4.2 Power Supply: MF sputtering power + DC Arc power + Bias Power Supply
4.3 Deposition control system
4.4 Operation System: Touch Screen + PLC, recipe control and data logging, Auto shutdown, auto evacuation, auto coating
4.5 Measuring System
Vacuum Pressure : Vacuum Gauge: Pirani + Penning gauge + Full range vacuum gauge -- Europe brand
Temperature measuring device: Thermocouple
MFC: Mass Flow Controller ( 4 ways ),
4.6 Alarm System: Compressed air pressure , Cooling water flow, Mis-operation
4.7 Power Load Indicator: Voltage indicator and load current indicator
5. Deposition System
5.1 Deposition source: Sputtering cathodes+ Arc sources + Ion Source
5.2 Deposition material: ITO, Titanium, Chrome, Aluminum, Stainless Steel, TiAl etc.
6. Sub-System
6.1 Air Compressed Valve Control System
6.2 Cooling Water System:Water flow pipe and switch valve system
7. Working Environment
Compressed Air: 5~8kg/cm2
Cooling Water: Water-In Temperature: 20~25℃, 200 Liter/min,
Water-In Pressure: 2~3 kg/cm2,
Power: 3 Phase 380V 50Hz(60Hz), 130kVA, average power consumption: 60KW
Installation Area: (L*W*H)4400*3200*2950mm
Exhaust: Vent for mechanical pumps
Applications
Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.
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Aluminum Oxide Copper PVD Plating Machine, PVD Copper Plating on Ceramic Sheets, Copper Deposition System Images
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